Graphite-fiber enhanced molded plastic for electronic enclosures

Electricity: conductors and insulators – Anti-inductive structures – Conductor transposition

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174 35GC, 174 35MS, 428141, 428143, 428148, H05K 900

Patent

active

061473014

ABSTRACT:
A technique for fabricating an improved electronic enclosure. The electronic enclosure is made of graphite fibers dispersed directionally (non-homogeneous) in an absolac/polycarbonate (ABS/PC) resin mix, of which the composition is molded to form the the plastic enclosure. The graphite concentration is highest along the interior surface of the enclosure to provide improved heat transfer, as well as adequate EMI/RFI shielding. However, the graphite concentration decrease along the thickness, wherein at the outer surface, the graphite concentration level is zero. The directional variation in the graphite loading allows high graphite loading at the interior surface of the enclosure, but retains lower loading at other regions along the thickness so that rigidity and impact resistance are retained for the enclosure.

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patent: 5827997 (1998-10-01), Chung et al.
patent: 5906882 (1999-05-01), Valente et al.
Amoco Performance Products, Inc. Brochure, High Thermal Conductivity Pitch Based Graphite Fibers, ThermalGraphR vs. Copper Comparison, Alpharetta, GA, pp. 1-31.
News Release--"Seminar shows status--and promise--of coninjection technology" Cincinnati Milarcron, Plastics Machinery Group, Dec. 1996, pp. 1-3.
Co-Mack Technology, Inc. Homepage, http://www.comack.com/homepage, Co-Mack Technology, Inc. 3151 Scott Street, Vista, CA 92083.

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