Composition and process for forming electrically insulating thin

Details Composition and process for forming electrically insulating thin Composition and process for forming electrically insulating thin

1998-03-31

2000-06-13

Marquis, Melvyn I.

Coating processes

Foraminous product produced

Microporous coating

427244, 427335, 427373, 521 64, 521 86, 521 88, 521 90, 521 91, 521 97, B05D 500

Patent

active

060746955

ABSTRACT:
To provide a composition for the formation of insulating films that can form an insulating film having a low dielectric constant. The composition comprises (A) an electrically insulating curable resin selected from the group consisting of electrically insulating curable organic resins and electrically insulating curable inorganic resins; and (B) at least two solvents: (B)(i) a solvent capable of dissolving resin (A) and (B)(ii) a solvent whose boiling point or vapor pressure curve differs from that of solvent (B)(i) or whose affinity for resin (A) differs from that of solvent (B)(i). Also claimed is a method for forming a insulating films that have a dielectric constant of less than 2.7.

REFERENCES:
patent: 3615272 (1971-10-01), Collins et al.
patent: 4756977 (1988-07-01), Haluska et al.
patent: 5238787 (1993-08-01), Haluska et al.
patent: 5416190 (1995-05-01), Mine et al.
patent: 5548159 (1996-08-01), Jeng
patent: 5840774 (1998-11-01), Ehrlich et al.
43RD Extended Abstracts of the Japn Society of Applied Physics and Related Societies, p. 654, Abstract 26a-N-6.
Pg 116 of the 1995 Proceedings of the Twelfth International VLSI Multilevel Interconnected Conference.

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