Studded chip attachment process

Details Studded chip attachment process Studded chip attachment process

1978-03-27

1979-12-25

Husar, Francis S.

Metal working

Method of mechanical manufacture

Electrical device making

29626, 228254, 228180A, 29589, H05K 334

Patent

active

041798023

ABSTRACT:
A plurality of metal studs are plated on a chip carrier surface in a pattern to match a terminal metal footprint on a chip to be joined. The studs are of sufficient height to permit flux cleaning, if necessary. After the studs are in place, the chip is aligned with the carrier and attached thereto, the chip pads containing a small amount of solder to provide the connecting joints. The carrier and chip are made of materials having nearly equal thermal expansion characteristics.

REFERENCES:
patent: 3330026 (1967-07-01), Best et al.
patent: 3373481 (1968-03-01), Lins et al.
patent: 3403438 (1968-10-01), Best et al.
patent: 3591839 (1971-07-01), Evans
patent: 3816270 (1974-06-01), Kniepkamp
patent: 3901770 (1975-08-01), Littwin

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