Temperature measuring device

Communications: electrical – Continuously variable indicating – Condition responsive

Patent

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Details

342368, H01Q 326

Patent

active

059696397

ABSTRACT:
Systems and methods are described for a wireless instrumented silicon wafer that can measure temperatures at various points and transmit those temperature readings to an external receiver. The device has particular utility in the processing of semiconductor wafers, where it can be used to map thermal uniformity on hot plates, cold plates, spin bowl chucks, etc. without the inconvenience of wires or the inevitable thermal perturbations attendant with them.

REFERENCES:
patent: Re32369 (1987-03-01), Stockton
patent: 5262944 (1993-11-01), Weisner

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