Semiconductor IC device having chip support element and electrod

Details Semiconductor IC device having chip support element and electrod Semiconductor IC device having chip support element and electrod

1997-04-29

1999-10-19

Abraham, Fetsum

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

257667, 257676, 257734, 257735, 257783, 257784, 257690, 257692, H01G 114

Patent

active

059694106

ABSTRACT:
In a plastic packaged semiconductor device, a chip support formed on the same lead frame as leads is disposed so as to extend over the surface of a semiconductor element, the chip support is bonded and fixed to the surface of a polyimide wafer coat on the semiconductor element by means of an insulating tape, the leads are brought into contact with the polyimide wafer coat on the semiconductor element without being fixed, the leads and the electrodes of the semiconductor element are connected by means of gold wires, and these are packaged by a packaging material. Generation of crack in the sealing material thereby prevented, and the thickness of the plastic packaged semiconductor device is reduced.

REFERENCES:
patent: 4989117 (1991-01-01), Hernandez
patent: 5399903 (1995-03-01), Rostoker et al.

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