Laser segmentation of plated through-hole sidewalls to form mult

Details Laser segmentation of plated through-hole sidewalls to form mult Laser segmentation of plated through-hole sidewalls to form mult

1999-01-28

2000-06-13

Young, Lee

Metal working

Method of mechanical manufacture

Electrical device making

29840, 29852, H05K 336

Patent

active

060733446

ABSTRACT:
A method for generating multiple conductor segments within a plated through hole of a printed circuit board. The method utilizes laser light to define the segmented surfaces bounding a hole in a circuit board. Two embodiments of this method are a subtractive process and an additive process. The subtractive process starts with a plated through hole and uses a laser to removes vertical strips of the PTH conductive lining to form the multiple conductive segments. The additive process applies a seeding material to a bare hole in a circuit board, removes vertical strips of the seeding material via laser scanning, and applies an electrically conductive material to the seeded surfaces to form the multiple conductive segments.

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