Thick film conductor composition

Compositions – Electrically conductive or emissive compositions – Free metal containing

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252514, 252518, 106 115, H01B 100

Patent

active

046954031

ABSTRACT:
A thick film conductor composition for a ceramic wiring substrate comprises an inorganic ingredient mainly composed of a copper oxide powder added with a metal capable of forming a homogeneous solid solution with copper, and an organic vehicle. The inorganic ingredient may be further added with a manganese oxide or a heat resistant insulating material such as ceramics and/or glass.

REFERENCES:
patent: 2993815 (1961-07-01), Treptow
patent: 3647532 (1972-03-01), Friedman et al.
patent: 4070518 (1978-01-01), Hoffman
patent: 4172919 (1979-10-01), Mitchell
patent: 4514321 (1985-04-01), Siuta
patent: 4521329 (1985-06-01), Suita et al.
patent: 4594181 (1986-06-01), Suita

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