Epoxy-containing die-attach compositions

Details Epoxy-containing die-attach compositions Epoxy-containing die-attach compositions

1997-06-20

1999-10-19

Marquis, Melvyn I.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

At least one aryl ring which is part of a fused or bridged...

524701, 524720, 524789, 528 95, 528 99, 528119, 528413, C08J 310

Patent

active

059690364

ABSTRACT:
In accordance with the present invention, there are provided novel compositions for attaching semiconductor devices to substrates. Invention compositions comprise liquid monomer vehicle comprising hydrophobic cyanate ester monomer(s) and epoxy monomer(s), electrically and/or thermally conductive filler, a metal catalyst, and an imidazole, preferably in the substantial absence of non-reactive diluents.

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Bauer et al., "Kinetics and modelling of thermal polycyclotrimerization of aromatic dicyanates" Acta Polymerica, 37:715-19 (1986).
Grigat and Putter, "New Methods of Preparative Organic Chemistry VI: Synthesis and Reactions of Cyanic Esters" Angew. Chem. (Intl Ed.), 6(3):206-218 (1967).
Shimp, D. A., "The Traslation of Dicyanate Structure and Cyclotrimerization Efficiency to Polycyanurate Properties" PMSE Preprints, ACS Meeting, 54:107-13 (1986).

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