Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element
Patent
2000-01-20
2000-10-31
Karlsen, Ernest
Electricity: measuring and testing
Fault detecting in electric circuits and of electric components
Of individual circuit component or element
324765, G01R 3102
Patent
active
061408263
ABSTRACT:
The present invention is concerned with a method and apparatus for performing a failure analysis on an integrated circuit chip package by mounting the package in a printed circuit board that is equipped with a recess (or an aperture) adapted for receiving the package and then making an electrical connection between the pin leads on the package and the terminals on the board such that when a backside surface layer of the package is later removed to expose the active circuit in the chip, the electrical connection between the chip and the board is substantially maintained so that a bias voltage can be fed into the chip to perform the failure analysis.
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"Novel Failure Analysis Techniques Using Photon Probing With A Scanning Optical Microscope", IEEE/IRPS, Cole Jr. et al., (month unavailable) 1994, pp: 388-397.
Karlsen Ernest
Vanguard International Semiconductor Corporation
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