Plastic article or earthenware shaping or treating: apparatus – Control means responsive to or actuated by means sensing or...
Patent
1985-07-08
1987-09-22
Woo, Jay H.
Plastic article or earthenware shaping or treating: apparatus
Control means responsive to or actuated by means sensing or...
264 407, 364148, 364473, 364476, 364477, 425143, 425144, 425149, 425171, B29C 4577, B29C 4578
Patent
active
046952373
DESCRIPTION:
BRIEF SUMMARY
BACKGROUND OF THE INVENTION
The present invention relates to an injection molding apparatus for melting a molding material to perform injection molding, wherein injection conditions can be automatically set.
In order to prepare a new product in a conventional injection molding apparatus, new molds are mounted therein to perform trial injection molding to preset parameters of injection molding conditions, such as an injection speed and an injection pressure. In this manner, optimal values are selected in accordance with a trial-and-error scheme. For this reason, skilled operators are required to preset such parameters, and even for skilled operators it takes a long period of time and a wealth of experience to set these parameters. Another conventional parameter preset scheme is known wherein initial conditions are determined by a program. Even in this case, parameters of the injection molding conditions change in accordance with conditions of molds and the external atmosphere. As a result, it is difficult to obtain optimal values.
SUMMARY OF THE INVENTION
It is an object of the present invention to solve the conventional drawbacks and to provide an injection molding apparatus for automatically setting injection conditions by performing trial injection.
In order to achieve the above object of the present invention, there is provided an injection molding apparatus comprising injection pressure detecting means for detecting an injection pressure, injection time detecting means for detecting an injection time, injection quantity detecting means for detecting an injection quantity, and a memory device for storing optimal values of parameters such as a cushion quantity, an injection pressure and an injection speed, for injection conditions corresponding to a time interval from a time at which injection is started to a time at which a maximum injection pressure is obtained and an injection quantity for the time interval, whereby trial injection is performed to cause the injection time detecting means and the injection quantity detecting means to detect a time and an injection quantity for which the injection pressure detecting means detects the maximum injection pressure, values of the parameters of the injection conditions are read out from the memory device in accordance with the detected time and the detected injection quantity, and the injection conditions are set to be readout values.
According to the present invention, when molds are replaced, trial injection is performed to obtain the time required for obtaining the maximum injection pressure and the corresponding injection quantity, and corresponding parameter values of the optimal injection conditions are automatically read out from a table in the memory device. Therefore, optimal injection conditions can be obtained by single trial injection. Even if injection conditions change in accordance with the external atmosphere or the like, substantially optimal injection conditions can be automatically set after a few trial injection cycles are performed to simply preset the optimal injection conditions. In contrast to the conventional injection molding apparatus, a long period of time is not required to preset the injection conditions. According to the present invention, since the injection conditions can be automatically preset, the injection conditions can be easily preset by unskilled operators. In contrast to the conventional injection molding apparatus, skilled operators who rely on their wide experience are not required.
BRIEF DESCRIPTION OF THE DRAWINGS
FIG. 1 is a block diagram of an injection molding apparatus according to an embodiment of the present invention; and
FIGS. 2-1 and 2-2 are flow charts for explaining the operation of the injection molding apparatus of FIG. 1.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT
The present invention will be described in detail with reference to the accompanying drawings.
FIG. 1 is a block diagram of an injection molding apparatus according to an embodiment of the present invention. Reference numera
REFERENCES:
patent: 3566439 (1971-03-01), Mouly et al.
patent: 3767339 (1973-10-01), Hunkar
patent: 4262737 (1981-04-01), Faillace
patent: 4540359 (1985-09-01), Yamazaki
patent: 4559991 (1985-12-01), Motomura et al.
Fanuc Ltd.
Heitbrink Timothy W.
Woo Jay H.
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