Suppression of hillock formation in thin aluminum films

Details Suppression of hillock formation in thin aluminum films Suppression of hillock formation in thin aluminum films

1999-08-31

2000-10-31

Picardat, Kevin M.

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

257773, 257776, H01L 214763

Patent

active

061407011

ABSTRACT:
A multilayer structure is provided which suppresses hillock formation due to post-heat treatment steps in thin aluminum films deposited on other substrates by sandwiching the aluminum film between thin layers of aluminum titanium nitride. The first aluminum titanium nitride layer acts as a compatibilizing layer to provide a better match between the coefficients of thermal expansion of the substrate and aluminum metal layer. The second aluminum titanium nitride layer acts as a cap layer to suppress hillock formation.

REFERENCES:
patent: 4012756 (1977-03-01), Chaudhari et al.
patent: 5231306 (1993-07-01), Meikle et al.
patent: 5404070 (1995-04-01), Tsai et al.
patent: 5700718 (1997-12-01), McTeer
patent: 5786232 (1998-07-01), Stansbury
patent: 5811318 (1998-09-01), Kweon
patent: 5838052 (1998-11-01), McTeer
patent: 5867242 (1999-02-01), Yao et al.
patent: 5868951 (1999-02-01), Schuck, III et al.
Onishi et al., "Influence of adding transition metal elements to an aluminum target on electrical resistivity and hillock resistance in sputter-deposited aluminum alloy thin films" J. Vac. Technol. A 14(5), Sep./Oct. 1996, pp. 2728-2735.

Affiliated with

Also associated with

Rating

Suppression of hillock formation in thin aluminum films does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Suppression of hillock formation in thin aluminum films, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Suppression of hillock formation in thin aluminum films will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2055209