Fabrication method of multilayer printed wiring board

Details Fabrication method of multilayer printed wiring board Fabrication method of multilayer printed wiring board

1996-12-24

1997-12-16

Picardat, Kevin

Fishing, trapping, and vermin destroying

437185, 437195, H01L 2160

Patent

active

056984707

ABSTRACT:
A fabrication method of a multilayer PWB that makes it possible to fabricate a multilayer PWB at low fabrication cost without the assembly and pressing processes. First, a first insulating layer serving as an undercoating layer is formed on a first patterned conductive layer and the uncovered surface of an insulating substrate. Next, the first insulating layer is exposed to light, thereby partially curing the first insulating layer. The combination of a second insulating layer and a second conductive layer is laminated under heat on the partially-cured first insulating layer so that the second insulating layer is contacted with the first insulating layer. During this step, the first insulating layer is heated and softened, thereby reducing its surface irregularity. The first and second insulating are then heated and entirely cured, and simultaneously, the substrate, the first conductive layer, the first insulating layer, the second insulating layer, and the second conductive layer are combined with each other. Thereafter, penetrating holes are formed to vertically penetrate the substrate, and the second conductive layer is patterned to form an outer circuit.

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patent: 5385867 (1995-01-01), Ueda et al.
patent: 5482900 (1996-01-01), Yang

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