Chemistry: electrical and wave energy – Apparatus – Electrolytic
Patent
1995-12-06
1998-04-21
Valentine, Donald R.
Chemistry: electrical and wave energy
Apparatus
Electrolytic
269 21, C25D 1706, B25B 1100
Patent
active
057414106
ABSTRACT:
The present invention relates to a method and apparatus for forming ball electrodes on electrode pads provided on a package. Solder balls and the electrode pads can be aligned with each other with high precision, and the cost of processing can be decreased. An installation apparatus for balls which holds the solder balls by vacuum suction is preferably formed of heat-resisting glass or other transparent material through which the balls may be observed. The solder balls are aligned with electrode pads provided on a package, and brought into contact with the electrode pads, with the solder balls and the electrode pads capable of being viewed through the installation apparatus from the top. Thereafter, a light beam is radiated from a light beam radiation light through the installation apparatus, thereby successively melting soldering paste on the electrode pads. In such a manner, the solder balls are fixed to the electrode pads. Consequently, ball electrodes are precisely formed.
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patent: 5342495 (1994-08-01), Tung et al.
patent: 5522975 (1996-06-01), Andricacos et al.
Sulich, "Wafer Holder for Electrodeposition of Contact Metallurgy", Oct. 1972, IBM Tech. Disc. Bulletin.
Kabushiki Kaisha Toshiba
Valentine Donald R.
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