Method of forming a multilayer electronic packaging substrate wi

Details Method of forming a multilayer electronic packaging substrate wi Method of forming a multilayer electronic packaging substrate wi

1996-11-27

1999-02-16

Vo, Peter

Metal working

Method of mechanical manufacture

Electrical device making

29830, 29832, 29851, 165 804, 174 151, 257703, 257713, 257714, 361698, 361699, H05K 322, H05K 346

Patent

active

058708235

ABSTRACT:
Disclosed is an electronic packaging substrate which includes a sintered ceramic body having at least one internal layer of wiring and at least one cooling channel internal to and integral with the sintered ceramic body for cooling a heat-generating electronic device placed on the sintered body. Also disclosed is a method of making the electronic packaging substrate.

REFERENCES:
patent: 2727632 (1955-12-01), Mack
patent: 4327399 (1982-04-01), Sasai et al.
patent: 4562092 (1985-12-01), Wiech, Jr.
patent: 4739443 (1988-04-01), Singhdeo
patent: 5034688 (1991-07-01), Moulene et al.
patent: 5099311 (1992-03-01), Bonde et al.
patent: 5099910 (1992-03-01), Walpole et al.
patent: 5158912 (1992-10-01), Kellerman et al.
patent: 5218515 (1993-06-01), Bernhardt
patent: 5313361 (1994-05-01), Martin
patent: 5317478 (1994-05-01), Sobhani
patent: 5436793 (1995-07-01), Sanvo et al.
patent: 5495889 (1996-03-01), Dubelloy
patent: 5506753 (1996-04-01), Bertin et al.
patent: 5510958 (1996-04-01), Shimabara et al.
patent: 5655290 (1997-08-01), Moresco et al.
patent: 5669136 (1997-09-01), Magee
L. F. Miller, Channels, Tunnels and Projections in Ceramic Slips, vol. 13, No. 3, Aug. 1970, p. 610.
H. D. Edmonds and G. Markovits, Heat Exchange Element For Semiconductor Device Cooling, vol. 23, No. 3, Aug. 1980, p. 1057.

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