Method for mounting and testing integrated circuits on printed c

Metal working – Method of mechanical manufacture – Electrical device making

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Details

29593, 29830, 29832, 29719, 29846, 228 62, 228103, 228104, 228175, 22818021, H05K 334

Patent

active

061451916

ABSTRACT:
An integrated circuit (IC) device is mounted onto a printed circuit board (PCB) by inducing a magnetic field of a selected strength at the surface of the PCB to temporarily hold the IC device onto the PCB. The IC device is provided with magnetic material which is attracted by the magnetic field. The magnetic field is maintained while the IC device and PCB are tested, and then subsequently during soldering when the IC device is permanently bonded to the PCB.

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