Semiconductor device comprising an SiOF insulative film

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum

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257637, 257650, H01L 2980

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active

057034044

ABSTRACT:
A semiconductor device having an interlayer insulating film improved to decrease film shrinkage and film stress is provided. Metal interconnections are formed on a substrate. A silicon oxide film is provided on the substrate to cover the metal interconnections and to fill a space between the metal interconnections. The chemical formula of the silicon oxide film contains Si-F bond.

REFERENCES:
patent: 5215787 (1993-06-01), Homma
patent: 5334552 (1994-08-01), Homma
patent: 5429995 (1995-07-01), Nishiyama et al.
patent: 5521424 (1996-05-01), Ueno et al.
Usami, Takashi, et al. "Low Dielectric Constant Interlayer . . . " Jpn. J. Appl. Phys. vol. 33, Jan. 1994 pp. 408-412.
Yeh, Ching-Fa, et al. "The Physicochemical Properties and Growth Mechanism . . . " J. Electrochem. Soc., vol. 141, No. 11, Nov. 1994, pp. 3177-3181.
Homma et al., "A Room Temperature Chemical Vapor Deposition SiOF Film Formation Technology for the Interlayer in Submicron Multilevel Interconnections" J. Electrochem Soc., vol. 140, No. 3, (Mar. 1993), pp. 687-692.
Gomarasca et al., "Properties of borophosphosilicate glass films deposited by different chemical vapor deposition techniques" J. Vac. Sci. Technol. B 10(2), Mar./Apr. 1992, pp. 633 to 642.
V. L. Shannon.sup.1 et al., "Study of the material poroperties and suitability of plasma-deposited fluorine-doped silicon dioxides for low dielectric constant interlevel dielectrics" Thin Solid Films 270 (1995), 1. 12. 1995, pp. 498-502.
Alonso et al., "Effect of the predecomposition of SiF.sub.4 on the properties of silicon dioxide deposited at low temperatures using SiF.sub.4 /SiH.sub.4 /N.sub.2 O in a double-plasma process" J. Vac. Sci. Technol. A 13(2), Mar./Apr. 1995, pp. 244-247.
Matsuura et al., "Novel Self-planarizing CVD Oxide for Interlayer Dielectric Applications" IEDM 94, pp. 117-120.
Shapiro.sup.a et al., "CVD of fluorosilicate glass for ULSI applications" Thin Solid Films 270 (1995), Dec. 1, 1995, pp. 503-507.
M. Matsuura et al, Novel Self-Planarizing CVD Oxide for Interlayer Dielectric Applications, Technical Digest of IEDM 94, pp. 117-120.
A. Kiermasz et al, Planarisation for Sub-Micron Devices Utilizing a New Chemistry, Proceedings of DUMIC Conference 1995, pp. 94-100.
Tetsuya Homma et al, A Room Temperature Chemical Vapor Deposition SiOF Film Formation Technology for the Interlayer in Submicron Multilevel Interconnections, J. Electrochemical Society, Inc., vol. 140, No. 3, Mar. 1993, pp. 687-692.

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