Enhanced heat transfer in printed circuit boards and electronic

Details Enhanced heat transfer in printed circuit boards and electronic Enhanced heat transfer in printed circuit boards and electronic

1994-09-09

1998-12-22

Thompson, Gregory

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

2989003, 165 802, 165 803, 165185, 174 163, 361690, 361719, 361720, H05K 720

Patent

active

058525483

ABSTRACT:
A structure for providing an enhanced heat transfer capability in a circuit board having electronic components and which is at least in part cooled by a gas flowing around the board. The enhanced heat transfer structure includes thermally conductive fibers attached at a first end to at least a portion of the exterior surfaces of the circuit board and/or electronic components thereof. The fibers extend out from the aforementioned exterior surfaces in a generally perpendicular direction, and are used to conduct heat from the circuit board and/or electronic components, and transfer it to the surrounding gas. Electrostatic fiber flocking methods are employed to attached the fibers in the aforementioned perpendicular orientation. It is also preferred that these thermally conductive fibers are carbon fibers, and attached to the exterior surface of the circuit board by a layer of adhesive. The enhanced heat transfer structure can be incorporated during the assembly of the board, or where the circuit board is an existing unit, the thermally conductive fibers can be attached without removing electronic components disposed thereon. Thus existing circuit boards can be retrofitted.

REFERENCES:
patent: 3706127 (1972-12-01), Oktay et al.
patent: 4485429 (1984-11-01), Mittal
patent: 4837664 (1989-06-01), Rodriguez, II et al.
patent: 4849858 (1989-07-01), Grapes et al.
patent: 4867235 (1989-09-01), Grapes et al.
patent: 5002715 (1991-03-01), Grapes et al.
patent: 5077637 (1991-12-01), Martorana et al.
patent: 5150748 (1992-09-01), Blackmon et al.
patent: 5287248 (1994-02-01), Montejano
patent: 5316080 (1994-05-01), Banks et al.
patent: 5358032 (1994-10-01), Arai et al.
Potente H. and Gabler K. A New Method for Flocking Plastic in Institut fur Kunstsoffverarberitung Hochschuke Aachen (No Known date).
Pontstr. 49, pp. 249-266 D-1500 Aachen West Germany, vol. I. No. 3, 1981.
Prof. Dr. A. Wehlow. the technique of flocking-Resurgence of a textile sector. (No known date).
Bolgen, Stig W. Flocking Technology. Journal of Coated Fabrics pp. 123-131, vol. 21, Oct. 1991.

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