Plastic encapsulated semiconductor device having wing leads

Details Plastic encapsulated semiconductor device having wing leads Plastic encapsulated semiconductor device having wing leads

1996-10-31

1997-12-30

Thomas, Tom

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

257696, 257693, 257666, 257700, H01L 2312, H01L 2350, H01L 2302

Patent

active

057033960

ABSTRACT:
In a plastic encapsulated semiconductor device, there is used a lead frame including an island for bearing thereon a semiconductor chip, a number of terminal leads extending outwardly from a proximity of the island, a pair of wing leads extending outwardly from a pair of opposite short-sides of the island. The wing leads are not coupled with tie-bars of the lead frame, and are positioned in a plane lower in level than a plane of the terminal leads. With this arrangement, even if pitch of the terminal leads is narrowed, the wing leads can be made not to interfere interfering with the terminal leads.

REFERENCES:
patent: 4920074 (1990-04-01), Shimizu et al.
patent: 4953007 (1990-08-01), Erdos
patent: 5049977 (1991-09-01), Sako
patent: 5436492 (1995-07-01), Yamanaka
patent: 5623162 (1997-04-01), Kurihara

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