Polishing slurry

Details Polishing slurry Polishing slurry

1998-11-02

1999-10-19

Koslow, C. Melissa

Compositions: coating or plastic

Coating or plastic compositions

Polishes

438692, 438693, 51307, 216 89, 252 791, 252 792, 252 794, 252 795, C09G 102, B24B 100, H01L 21304

Patent

active

059682396

ABSTRACT:
A polishing slurry for use in chemical mechanical polishing is disclosed. The polishing slurry contains a solvent and polishing particles dispersed in this solvent. The polishing particles are selected from silicon nitride, silicon carbide, and graphite. The primary particle size of the polishing particles dispersed in the solvent is appropriately 0.01 to 1000 nm. When the polishing particles are colloidally dispersed in the solvent, the secondary particle size of the polishing particles is appropriately 60 to 300 nm.

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patent: 5603739 (1997-02-01), Neuland
patent: 5607718 (1997-03-01), Sasaki et al.

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