Face-up semiconductor chip assembly

Details Face-up semiconductor chip assembly Face-up semiconductor chip assembly

1998-07-06

1998-12-22

Saadat, Mahshid

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

257701, 257690, H01L 2348, H01L 2352

Patent

active

058523260

ABSTRACT:
A semiconductor assembly having contacts on a peripheral region of the top surface of a chip and a backing element overlying the bottom surface of the chip. The backing element has terminals such that at least some of the terminals overlie the bottom surface of the chip. Leads including bonding wires extending alongside the edges of the chip connect the contacts and the terminals. The terminals of the assembly are movable with respect to the chip.

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patent: 5679977 (1997-10-01), Khandros et al.
patent: 5685885 (1997-11-01), Khandros et al.

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