Method of transferring a surface relief pattern from a wet poly(

Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board

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96 351, 96 362, 96115R, 204192E, 427 43, B05D 306

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active

041267125

ABSTRACT:
This invention pertains to a method for forming a surface relief pattern in a metal layer which comprises forming a wet poly(olefin sulfone) layer on the metal layer, forming a surface relief pattern in the wet poly(olefin sulfone) layer, and sputter etching the surface relief pattern from the wet poly(olefin sulfone) layer into the metal layer.

REFERENCES:
patent: 3615956 (1971-10-01), Irving et al.
patent: 3884696 (1975-05-01), Bowden et al.
patent: 3893127 (1975-07-01), Kaplan et al.
patent: 3935332 (1976-01-01), Poliniak et al.
patent: 3964909 (1976-06-01), Himics et al.
Vossen et al., "J. Vac. Sci. Tech.", vol. 12, No. 5, Sep./Oct. 1975, pp. 1052-1057.

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