Method and apparatus for sputter cleaning and bias sputtering

Details Method and apparatus for sputter cleaning and bias sputtering Method and apparatus for sputter cleaning and bias sputtering

1977-08-04

1978-11-21

Mack, John H.

Chemistry: electrical and wave energy

Processes and products

Vacuum arc discharge coating

204192E, 204298, C23C 1500

Patent

active

041265300

ABSTRACT:
Cathode sputtering apparatus and a related method for its use in sputter cleaning and bias sputtering operations, in which work-pieces to be sputter-cleaned are secured to a cathode assembly in a configuration lending itself to the utilization of plasma traps which are highly conducive to efficient sputtering. Two basic embodiments are disclosed. In one embodiment, the cathode assembly takes the form of a hollow cylinder with inwardly projecting end flanges, the work-pieces being mounted with their surfaces to be cleaned facing inwardly, and in the other embodiment it takes the form of a cylindrical post with outwardly projecting end flanges, with the surfaces to be cleaned facing outwardly.Also disclosed are related techniques for sputter coating work-pieces immediately following a sputter cleaning step.

REFERENCES:
patent: 3341442 (1967-09-01), Kay
patent: 3507248 (1970-04-01), Seeley et al.
patent: 3661747 (1972-05-01), Byrnes, Jr. et al.
patent: 3728246 (1973-04-01), Barkhudarov et al.
patent: 3775285 (1973-11-01), Lane
patent: 3884793 (1975-05-01), Penfold et al.
patent: 3964986 (1976-06-01), Mark
patent: 3998718 (1976-12-01), Melliar-Smith
patent: 4041353 (1977-08-01), Penfold et al.
E. J. Brainard et al., "RF Sputter Etching & In-Situ Evaporation of Metals", IBM Tech. Disc. Bull., vol. 19, pp. 2523-2524 (1976).

Affiliated with

Also associated with

Rating

Method and apparatus for sputter cleaning and bias sputtering does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method and apparatus for sputter cleaning and bias sputtering, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus for sputter cleaning and bias sputtering will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2048467