Manufacturing method of ink jet head

Etching a substrate: processes – Forming or treating thermal ink jet article

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H01L 21306

Patent

active

06139761&

ABSTRACT:
A manufacturing method for an ink jet head having an ink ejection pressure generation element for generating energy for ejecting ink, and an ink supply port for supplying the ink to an ink jet head, including the steps of preparing a silicon substrate; forming, on a surface of the silicon substrate, the ink ejection pressure generation element and silicon oxide film or silicon nitride film; forming anti-etching mask for forming an ink supply port on a back side of the silicon substrate; removing silicon on the back side of the silicon substrate at a position corresponding to the ink supply port portion through anisotropic etching; forming an ink ejection portion on a surface of the silicon substrate; and removing the silicon oxide film or silicon nitride film from the surface of the silicon substrate of the ink supply port portion.

REFERENCES:
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patent: 4961821 (1990-10-01), Drake et al.
patent: 4985710 (1991-01-01), Drake et al.
patent: 5277755 (1994-01-01), O'Neill
patent: 5308442 (1994-05-01), Taub et al.
patent: 5383635 (1995-01-01), Barone

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