Wafer polishing apparatus and backing pad for wafer polishing

Details Wafer polishing apparatus and backing pad for wafer polishing Wafer polishing apparatus and backing pad for wafer polishing

1999-06-01

2000-10-31

Rose, Robert A.

Abrading

Machine

Rotary tool

451398, B24B 722

Patent

active

061394092

ABSTRACT:
A wafer polishing apparatus includes a rotatably supported polishing table, a pad, a carrier head, and a backing pad. The pad is fixed to the polishing table. The carrier head is arranged to oppose the polishing table and is supported to be rotatable and movable forward/backward with respect to the polishing table. The backing pad is fixed to a surface of the carrier head which opposes the polishing pad, and presses a wafer against the polishing pad by cooperation with compressed air. The backing pad is constituted by an annular foamed body having closed cells to press an outer peripheral portion of the wafer, and a columnar second foamed body having open cells and provided inside the first foamed body.

REFERENCES:
patent: 4521995 (1985-06-01), Sekiya
patent: 5267418 (1993-12-01), Currie et al.
patent: 5645474 (1997-07-01), Kubo et al.
patent: 5762539 (1998-06-01), Nakashiba et al.
patent: 5791973 (1998-08-01), Nishio
patent: 5938512 (1999-08-01), Takei et al.

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