Method and apparatus for mechanical and chemical-mechanical plan

Details Method and apparatus for mechanical and chemical-mechanical plan Method and apparatus for mechanical and chemical-mechanical plan

1997-12-30

2000-10-31

Scherbel, David A.

Abrading

Abrading process

Glass or stone abrading

451168, 451530, 451173, B24B 100, B24B 700

Patent

active

061394025

ABSTRACT:
A method and apparatus for mechanically and/or chemical-mechanically planarizing microelectronic substrates. In one embodiment in accordance with the principles of the present invention, a microelectronic substrate is planarized or polished on a planarizing medium having a thin film and a plurality of micro-features on the film. The film may be an incompressible sheet or web substantially impervious to a planarizing solution, and the micro-features may be configured in a selected pattern on the film to restrain fluid flow of the planarizing solution across the surface of the film under the substrate. The micro-features, for example, may be configured in a selected pattern that has a plurality of support points and at least one cavity to entrap a substantially contiguous, uniform distribution of the solution under the substrate during planarization. Additionally, the selected pattern of micro-features may be reproduced from a master pattern of micro-features to duplicate the selected pattern on several sections of film so that a consistent planarizing surface may be provided for a large number of substrates.

REFERENCES:
patent: 5234867 (1993-08-01), Schultz et al.
patent: 5421769 (1995-06-01), Schultz et al.
patent: 5489233 (1996-02-01), Cook et al.
patent: 5554064 (1996-09-01), Breivogel et al.
patent: 5624303 (1997-04-01), Robinson
patent: 5628862 (1997-05-01), Yu et al.
patent: 5810964 (1998-09-01), Shiraishi
patent: 5839947 (1998-11-01), Kimura et al.

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