Sub-resolution phase shift mask

Radiation imagery chemistry: process – composition – or product th – Radiation modifying product or process of making – Radiation mask

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430313, G03F 900

Patent

active

056983492

ABSTRACT:
The invention describes the fabrication and use of a sub-resolution phase shift mask. The mask is formed using a single alignment step with all other alignment steps being accomplished by self alignment. This self alignment is made possible by using vertical anisotropic etching of an opaque material layer to form opaque spacers at the pattern edges of phase shifting material. The opaque spacers combine with phase shifting and other opaque regions of the mask to provide improved image resolution and depth of focus tolerance at the surface of an integrated circuit wafer.

REFERENCES:
patent: 5045417 (1991-09-01), Okamoto
patent: 5288568 (1994-02-01), Cathey
patent: 5300379 (1994-04-01), Dao
patent: 5382483 (1995-01-01), Young
patent: 5455131 (1995-10-01), Kang et al.
patent: 5532089 (1996-07-01), Adair et al.
"Lithography's Leading Edge, Part 1: Phase Shift Technology," pub. in Semiconductor International, Feb. 1992, pp. 42-47.

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