Stacked leads-over chip multi-chip module

Details Stacked leads-over chip multi-chip module Stacked leads-over chip multi-chip module

1999-04-27

2000-07-18

Williams, Alexander Oscar

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

For plural devices

257777, 257680, 257778, 257737, 257679, 257698, H01L 2350, H01L 2312, H01L 2616

Patent

active

060911433

ABSTRACT:
A multi-chip module (MCM) and method of manufacturing is disclosed that provides for attachment of semiconductor dice to both sides of the MCM printed circuit board (PCB). Semiconductor dice attached to the top surface of the PCB may be attached by conventional wire bonding, TAB or flip chip methods whereas those semiconductor dice attached to the bottom surface of the PCB are wire bonded or TAB connected to the top surface through openings in the PCB. The openings provide a lead-over-chip (LOC) arrangement for those semiconductor dice attached to the bottom surface, resulting in shortened wire bonds. The bottom surface of the PCB may be provided with die recesses into which the openings extend to receive the dice and bring their active surfaces even closer to the top surface of the PCB for wire bonding.

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