Process for manufacturing a circuit board with filled holes

Details Process for manufacturing a circuit board with filled holes Process for manufacturing a circuit board with filled holes

1998-02-25

2000-10-31

Harrison, Jessica J.

Metal working

Method of mechanical manufacture

Electrical device making

29832, 29830, 29840, 29837, 174262, 174263, H01K 310

Patent

active

061383503

ABSTRACT:
A process for manufacturing circuit boards comprising providing a circuitized substrate having a dielectric surface, providing a peel apart structure including a metal layer and a peelable film, laminating the peel apart structure to the circuitized substrate with the metal layer positioned adjacent said dielectric surface, forming holes in the circuitized substrate through the peel apart structure, applying a filler material including an organic base to the peel apart structure, applying a sacrificial film onto the filler material, and applying sufficient heat and pressure to the sacrificial film to force the filler material into the holes to substantially fill the holes is provided.

REFERENCES:
patent: 3163588 (1964-12-01), Shortt et al.
patent: 3387365 (1968-06-01), Stelmak
patent: 4127699 (1978-11-01), Aumiller et al.
patent: 4135988 (1979-01-01), Dugan et al.
patent: 4153988 (1979-05-01), Doo
patent: 4210704 (1980-07-01), Chandross et al.
patent: 4221047 (1980-09-01), Narken et al.
patent: 4354895 (1982-10-01), Ellis
patent: 4585502 (1986-04-01), Uozu et al.
patent: 4590539 (1986-05-01), Sanjana et al.
patent: 4618567 (1986-10-01), Sullivan
patent: 4727649 (1988-03-01), Nishizawa
patent: 4731503 (1988-03-01), Kitanishi
patent: 4747968 (1988-05-01), Gilleo
patent: 4791248 (1988-12-01), Oldenettel
patent: 4822523 (1989-04-01), Prud'Homme
patent: 4880570 (1989-11-01), Sanborn et al.
patent: 4882245 (1989-11-01), Gelorme et al.
patent: 4882839 (1989-11-01), Okada
patent: 4893404 (1990-01-01), Shirahata et al.
patent: 4904414 (1990-02-01), Peltz et al.
patent: 4940651 (1990-07-01), Brown et al.
patent: 4964948 (1990-10-01), Reed
patent: 4967314 (1990-10-01), Higgins, III
patent: 4991060 (1991-02-01), Kawakami et al.
patent: 4999136 (1991-03-01), Su et al.
patent: 5026624 (1991-06-01), Day et al.
patent: 5028743 (1991-07-01), Kawakami et al.
patent: 5057372 (1991-10-01), Imfeld et al.
patent: 5065227 (1991-11-01), Frankeny et al.
patent: 5070002 (1991-12-01), Leech et al.
patent: 5082595 (1992-01-01), Glackin
patent: 5117069 (1992-05-01), Higgins, III
patent: 5200026 (1993-04-01), Okabe
patent: 5210941 (1993-05-01), Turek et al.
patent: 5220724 (1993-06-01), Gerstner
patent: 5243142 (1993-09-01), Ishikawa et al.
patent: 5262247 (1993-11-01), Kajiwara et al.
patent: 5266446 (1993-11-01), Chang et al.
patent: 5271150 (1993-12-01), Inasaka
patent: 5300402 (1994-04-01), Card, Jr. et al.
patent: 5304252 (1994-04-01), Condra et al.
patent: 5319159 (1994-06-01), Watanabe et al.
patent: 5346750 (1994-09-01), Hatakeyama et al.
patent: 5348574 (1994-09-01), Tokas et al.
patent: 5366027 (1994-11-01), Turek et al.
patent: 5373629 (1994-12-01), Hupe et al.
patent: 5427895 (1995-06-01), Magnuson et al.
patent: 5439779 (1995-08-01), Day et al.
patent: 5463190 (1995-10-01), Carson et al.
patent: 5487218 (1996-01-01), Bhatt et al.
patent: 5494764 (1996-02-01), Hyodo
patent: 5541567 (1996-07-01), Fogel
patent: 5557844 (1996-09-01), Bhatt et al.
patent: 5566840 (1996-10-01), Waldner et al.
patent: 5981305 (1999-11-01), Hattori
Glenda Derman, "New Avenue for Microvias", Electronic Engineering Times, Mar. 18, 1996, p. 68.
Marshall, J.H., "Printed Circuit Base", IBM TDB, vol. 10, No. 5, Oct. 1967.
McDermott, C.J., "Face Protection of Printed Circuit Boards", IBM TDB, vol. 11, No. 7, Dec. 1968.

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