Thermal microplatform

Details Thermal microplatform Thermal microplatform

1997-11-17

2000-07-18

Walberg, Teresa

Electric heating

Heating devices

Combined with diverse-type art device

257415, H05B 100, H01L 2982

Patent

active

06091050&

ABSTRACT:
A micromachined platform structure includes a substrate having a major surface and a platform positioned over the major surface. Plural support beams are tethered between the substrate and the platform, with each support beam including at least a first layer exhibiting a first thermal coefficient of expansion (TCE) and a second layer with a second TCE, the first TCE greater than the second TCE. The first layer is deposited on the second layer at a temperature that is higher than an ambient temperature at which the platform is to be used. Thus, at the ambient use temperature, the first layer is in a contraction/tension state relative to the second layer and causes a flexure of the support beams and an elevation of the platform away from the substrate's major surface.

REFERENCES:
patent: 4556050 (1985-12-01), Hodgson et al.
patent: 4736629 (1988-04-01), Cole
patent: 5058856 (1991-10-01), Gordon et al.
patent: 5140155 (1992-08-01), Carome
patent: 5295206 (1994-03-01), Mischenko
patent: 5475318 (1995-12-01), Marcus et al.
patent: 5536963 (1996-07-01), Polla
patent: 5626779 (1997-05-01), Okada
patent: 5635750 (1997-06-01), Schlaak et al.
patent: 5659195 (1997-08-01), Kaiser et al.
patent: 5796152 (1998-08-01), Carr et al.
patent: 5810325 (1998-09-01), Carr
The 8th Internat'l Conference on Solid-State Sensors and Actuators and Eurosensors IX-Digest of Technical Papers, pp. 818-821, Jun. 25-29, 1995, vol. 2, Fung et al., "Thermal Analysis and Design of a Micro-Hotplate for Integrated Gas Sensor Applications".
Proceedings of SPIE, Smart Structures and Meterials 1997, vol. 3046, pp. 273-283, Manginell et al., "An Overview of Micromachined Platforms for Thermal Sensing and Gas Detection".

Affiliated with

Also associated with

Rating

Thermal microplatform does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Thermal microplatform, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Thermal microplatform will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2038910