Patent
1989-09-14
1991-04-09
Hille, Rolf
357 72, 357 74, 357 75, H01L 3902, H01L 2316, H01L 2302, H01L 2312
Patent
active
050069233
ABSTRACT:
A substrate is formed from a core substrate of flexible, low-temperature co-fireable ceramic tape and an outer substrate of ceramic tape having apertures for receiving integrated circuits (ICs) therein. The substrate is heated to form a rigid body which then mounts the ICs. The rigid body and ICs are covered or at least partially covered with an insulating glass and heated to a temperature that fuses the glass but does not harm to ICs. The resulting structure hermetically seals the ICs in a single substrate that is insensitive to acceleration forces.
REFERENCES:
patent: 4680617 (1987-07-01), Ross
patent: 4691255 (1987-09-01), Murakami et al.
patent: 4709468 (1987-12-01), Wilson
patent: 4754319 (1988-06-01), Saito et al.
Suss Report, Sep. 1988, p. 3, Rogers, Microtec Multichip Modules, A New Generation in Interconnection Technology.
H. C. Bhedwar et al., Hybrid Circuit Technology, Low Temperature Cofireable Ceramic System with Buried Resistors and Post-Fired Metallization, May 1989, p. 31.
Corning Applications Information, Sealing Glass Corning Code 7585, issued Jun. 24, 1980.
Corning Applications Information, Sealing Glass Corning Code 7589, issued Feb., 1981.
Hille Rolf
Litton Systems Inc.
Ostrowski D.
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