Electrical components

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357 80, 357 68, H01L 2302, H01L 2312

Patent

active

050069209

ABSTRACT:
An electronic modular unit such as an integrated semiconductor unit is disclosed. The inventive electronic unit can be bonded to a support or to another modular unit. For this purpose, the inventive unit is provided with projections or recesses so that units can mate with one another. The projections may be formed by an etching process. Electrical connections as well as mechanical connections between units may be achieved using the projections and recesses.

REFERENCES:
patent: 3832603 (1974-08-01), Cray et al.
patent: 4125935 (1978-11-01), Ammon
patent: 4754316 (1988-06-01), Reid
Peter Kastner, "Halbleiter Technologie, Vogelverlag 1980", pp. 91-103.
Gunter Kas, "Schichtelektronick, Lexika-Verlag 1978", pp. 55-74.
Petersen, "Silicon as a Mechanical Material", Proceedings of the IEEE, vol. 70, No. 5, May, 1982.

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