Method of manufacturing electronic component

Metal working – Method of mechanical manufacture – Electrical device making

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Details

29840, 156 89, 257827, 257848, 257700, H05K 330

Patent

active

058506888

ABSTRACT:
An electronic element which is free of many of the impurities that tend to adversely affect its operation. The electronic element is hermetically sealed in a space formed by a framework having a first and second plate directly joined to its sides. Directly joining the first and second plates to the framework prevents splashes of adhesive and soldering material from effecting the operation of the electronic element.

REFERENCES:
patent: 4639632 (1987-01-01), Nakata et al.
patent: 5448826 (1995-09-01), Goetz et al.
patent: 5465008 (1995-11-01), Goetz et al.
patent: 5545849 (1996-08-01), Kondo

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