Sputtering apparatus

Details Sputtering apparatus Sputtering apparatus

1990-07-16

1991-04-09

Nguyen, Nam X.

Chemistry: electrical and wave energy

Apparatus

Coating, forming or etching by sputtering

20429807, 20429815, 20429816, 20429819, C23C 1434

Patent

active

050062182

ABSTRACT:
A sputtering apparatus includes: a discharge chamber having four curved side surfaces protruding toward a center of the chamber to form a discharge space surrounded by the side surfaces therein; a gas inlet and a gas outlet each formed at the chamber; cylindrical cathodes; plural permanent magnets arranged outside each of the side surfaces of the chamber; a sputtering electrode arranged at the space surrounded by the curved side surfaces; and a bed for holding a substrate, which is arranged in the chamber and opposed to the sputtering electrode. Each of the cathodes is arranged between the adjacent curved side surfaces of the chamber. A negative electric potential is applied to each of the cathodes. The adjacent permanent magnets have different magnetic poles to each other. The surface of substrate held by the bed is parallel to the opposed surface of the sputtering electrode, and the surfaces of the substrate and the electrode are arranged crossing the curved side surfaces.

REFERENCES:
patent: 4038171 (1977-07-01), Moss et al.
patent: 4627904 (1986-12-01), Mintz
patent: 4818359 (1989-04-01), Jones et al.

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