Heat exchange – Heat transmitter
Patent
1988-03-17
1989-12-05
Schwadron, Martin P.
Heat exchange
Heat transmitter
174 163, 357 82, 361384, F28F 302, H01L 2336
Patent
active
048846317
ABSTRACT:
A high efficiency forced air heat sink assembly employs a split feed transverse flow configuration to minimize the length of the air flow path through at least two separated fin structures. Different embodiments use different fin structure material configurations including honeycomb, corrugated and serpentine. Each such embodiment uses a thermally conductive plate having opposed exterior surfaces; one for receiving a component to be cooled and one for receiving the fin structures. The serpentine structured fin embodiment employs a plurality of fin supports extending from the plate and forming a plurality of channels for receiving the fin structures. A high thermal conductivity bondant, such as metal-filled epoxy, may be used to bond the fin structures to either the plate or the fin supports. Dip brazing and soldering may also be employed depending upon the materials selected.
REFERENCES:
patent: 3180404 (1965-04-01), Nelson et al.
patent: 3592260 (1971-07-01), Berger
patent: 4270604 (1981-06-01), Nakamura
patent: 4345643 (1982-08-01), Dawson et al.
patent: 4777560 (1988-10-01), Herrell et al.
IBM Tech. Discl. Bulletin, "High Performance Air--Cooled Module", vol. 28, No. 7, Dec. 1985, pp. 3058-3059.
California Institute of Technology
Flanigan Allen J.
Schwadron Martin P.
Tachner Leonard
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