Method for galvanic deposition of copper

Details Method for galvanic deposition of copper Method for galvanic deposition of copper

1981-03-17

1983-12-06

Kaplan, G. L.

Chemistry: electrical and wave energy

Processes and products

204 52R, 204231, C25D 338

Patent

active

044191928

ABSTRACT:
In a method for galvanic deposition of smooth and ductile copper from acid copper baths, the metal content of the bath is kept constant by using inert anodes together with soluble anodes. The inert anodes are made of precious metal, precious metal alloys or their compounds. The ratio of the geometric surface of inert to soluble anode should amount to from 1:1 to 1:200, preferably from 1:5 to 1:20. The inert anode may be provided with additional potential, and the acid bath may contain organic thio compounds. The method is useful for building up conductor paths of printed circuits.

REFERENCES:
patent: 1465034 (1923-08-01), Antisell
patent: 2133255 (1938-10-01), Rogers
Research Disclosure, #19045, Feb. 1980.
V. I. Lainer, "Modern Electroplating", pp. 109-113, (1970).
J. K. Dennis et al., "Nickel and Chromium Plating", pp. 67-68, (1972).
J. Homer Winkler, Preprint 80-28, The Electrochemical Soc., pp. 349-354, (1941).

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