Method of manufacturing fusible links in semiconductor devices

Details Method of manufacturing fusible links in semiconductor devices Method of manufacturing fusible links in semiconductor devices

1991-12-30

1993-09-14

Hearn, Brian E.

Fishing, trapping, and vermin destroying

437922, 148DIG131, H01L 2144

Patent

active

052448363

ABSTRACT:
The present invention provides a method of forming fuse ribbons between conductive layers on a semiconductor device. The formation of these fuse ribbons may be at different levels of multiple level integrated circuits. The fuse ribbons are formed in a more precise manner than can be obtained conventionally. Resistance control can be easily achieved and significant decreases in dimensions and the use of less fuse material can be achieved.

REFERENCES:
patent: 4491860 (1985-01-01), Lim
patent: 5011791 (1991-04-01), Mastroianni
patent: 5015604 (1991-05-01), Lim et al.
patent: 5017510 (1991-05-01), Welch et al.
patent: 5120679 (1992-06-01), Boardman et al.

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