Package for semiconductor devices with first and second metal la

Details Package for semiconductor devices with first and second metal la Package for semiconductor devices with first and second metal la

1979-02-09

1980-10-21

James, Andrew J.

Electricity: conductors and insulators

Feedthrough or bushing

Compression

357 80, 357 73, 174 52FP, H01L 2302, H01L 2312, H01L 3902

Patent

active

042297583

ABSTRACT:
A package for sealing an MOS type semiconductor element having a die-attach area comprising a first metal layer composed of gold and a second metal layer composed of a metal having a good bondability to aluminum metal, which is electrically connected to the first metal layer.

REFERENCES:
patent: 3501833 (1970-03-01), Spiegler
patent: 3617819 (1971-11-01), Boisvert
patent: 3634600 (1972-01-01), Griffin
patent: 3681513 (1972-08-01), Hargis
patent: 3697666 (1972-10-01), Wakley et al.
patent: 3898594 (1975-08-01), Hochberg et al.
patent: 4032350 (1977-06-01), Greenstein
patent: 4092664 (1978-05-01), Davis
patent: 4142203 (1979-02-01), Dietz
patent: 4145120 (1979-03-01), Kubota

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