Method for planarizing an array of solder balls

Details Method for planarizing an array of solder balls Method for planarizing an array of solder balls

1997-10-30

2000-07-18

Vo, Peter

Metal working

Method of mechanical manufacture

Electrical device making

29843, 29DIG44, H05K 334, H05K 1304

Patent

active

060889144

ABSTRACT:
A method for mounting an integrated circuit includes a plurality of solder balls arrayed on the bottom surface of a package of the integrated circuit onto to a circuit board. These solder balls provide for surface mounting of the integrated circuit to a circuit board by solder reflow. The array of solder balls can be planarized so that each of the plural solder balls participate in defining a truly planar solder ball contact array for the integrated circuit package. Methods of manufacturing the integrated circuit with a package having planarized solder balls in an array dependent from a bottom surface thereof are set forth. The truly planarized solder ball contact array of the integrated circuit package affords nearly absolute reliability in forming of surface-mount electrical connections between the integrated circuit package and the circuit board on which the package is to mount. Additionally, the planarized solder ball contacts locally compensate individually for warpage of the integrated circuit package by variation in the individual dimensions of dependency of each solder ball below the bottom surface of the package.

REFERENCES:
patent: 2366935 (1945-01-01), Schmid
patent: 3833230 (1974-09-01), Noll
patent: 3871015 (1975-03-01), Lin et al.
patent: 4521995 (1985-06-01), Sekiya
patent: 4603466 (1986-08-01), Morley
patent: 4604644 (1986-08-01), Beckham et al.
patent: 4661192 (1987-04-01), McShane
patent: 4693036 (1987-09-01), Mori
patent: 4752027 (1988-06-01), Gschwend
patent: 4830264 (1989-05-01), Bitaillou et al.
patent: 5029383 (1991-07-01), Snyder et al.
patent: 5060844 (1991-10-01), Behun et al.
patent: 5121299 (1992-06-01), Frankeny et al.
patent: 5167361 (1992-12-01), Liebman et al.
patent: 5214308 (1993-05-01), Nishiguchi et al.
patent: 5275330 (1994-01-01), Isaacs et al.
patent: 5355283 (1994-10-01), Marrs et al.
patent: 5400950 (1995-03-01), Myers et al.
patent: 5435482 (1995-07-01), Variot et al.
patent: 5461261 (1995-10-01), Nishiguchi
patent: 5465152 (1995-11-01), Bilodeau et al.
patent: 5489750 (1996-02-01), Sakemi et al.
IBM Technical Disclosure Bulletin, "Micro-Miniature Solder Flattening Assembly," vol. 31, No. 12, May 1989.

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