Semiconductor wafer with alignment marks and method for manufact

Details Semiconductor wafer with alignment marks and method for manufact Semiconductor wafer with alignment marks and method for manufact

1982-06-18

1983-12-06

Hearn, Brian E.

Metal working

Method of mechanical manufacture

Assembling or joining

29578, 148 33, 2504922, 356401, 430 22, H01L 2166

Patent

active

044184670

ABSTRACT:
A method is provided for manufacturing a semiconductor device, comprising the steps of forming alignment marks on a side surface of a semiconductor wafer, aligning the semiconductor wafer with a unit apparatus for manufacturing the semiconductor device utilizing the alignment mark, and processing the semiconductor wafer with the unit apparatus. The alignment mark attached on the side surface of the wafer can be identified even if chip patterns or various films are formed on the wafer.

REFERENCES:
patent: 4345836 (1982-08-01), Phillips
patent: 4376581 (1983-03-01), Mayer

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