Method of mounting semiconductor elements

Details Method of mounting semiconductor elements Method of mounting semiconductor elements

1991-11-19

1993-09-14

Rosenbaum, Mark

Metal fusion bonding

Process

Plural joints

437902, 257712, B23K 3102

Patent

active

052441423

ABSTRACT:
A method of mounting a plurality of semiconductor elements each having bump electrodes on a wiring board by pressing the semiconductor elements to the wiring board while aligning the electrodes and heating the structure. In the mounting method, one or more heat sinks are previously joined to the backs opposite to the surfaces with the bump electrodes formed thereon of the semiconductor elements.

REFERENCES:
patent: 4292647 (1981-09-01), Lee
patent: 4604644 (1986-08-01), Beckham et al.
patent: 4770242 (1988-09-01), Daikoku et al.
patent: 4825284 (1989-04-01), Soga et al.
patent: 5001548 (1991-03-01), Iverson
patent: 5005638 (1991-04-01), Goth et al.
patent: 5024264 (1991-06-01), Natori et al.

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