Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1994-07-28
1995-11-28
Tolin, Gerald P.
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
174 524, 257724, 361719, 361792, H05K 720
Patent
active
054713668
ABSTRACT:
A multi-chip module includes a substrate, an interconnection pattern provided on the substrate, a plurality of semiconductor chips provided commonly upon the substrate in electrical connection with the interconnection pattern, a plurality of thermally conductive blocks each provided on corresponding one of the plurality of semiconductor chips in an intimate contact therewith, a resin package body that encapsulates the plurality of semiconductor chips and the plurality of thermally conductive blocks together with the substrate, such that the resin package body has an upper major surface substantially flush with the upper major surfaces of the plurality of thermally conductive blocks, and a heat sink mounted upon the upper major surface of the resin package body such that the heat sink establishes an intimate contact with respective upper major surfaces of the thermally conducting blocks.
REFERENCES:
patent: 4729061 (1988-03-01), Brown
patent: 5065280 (1991-11-01), Karnezos
patent: 5172213 (1992-12-01), Zimmerman
patent: 5173844 (1992-12-01), Adachi
Fujitsu Limited
Tolin Gerald P.
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