Three dimensional mounting assembly for integrated circuits

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

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Details

361736, 361788, 361790, 361803, 361809, 439 61, H05K 114

Patent

active

061282014

ABSTRACT:
A system and method for efficiently interconnecting a plurality of ICs, thereby improving the electrical performance of the overall system. In one embodiment of the system of the present invention, a plurality of carriers corresponds to a plurality of ICs, and a board has a plurality of board regions for receiving the plurality of ICs and are arranged so as to be attached to a backplane forming a vertical stack of boards.

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