Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – Processes of preparing a desired or intentional composition...
Patent
1995-02-21
1996-04-02
Morgan, Kriellion S.
Synthetic resins or natural rubbers -- part of the class 520 ser
Synthetic resins
Processes of preparing a desired or intentional composition...
524105, 548520, C07D20740, C08K 53415
Patent
active
055041280
DESCRIPTION:
BRIEF SUMMARY
TECHNICAL FIELD
The present invention relates to a thermoplastic resin composition and a method of molding the composition.
TECHNICAL BACKGROUND
Recently heat-resistant thermoplastic resins have been used as engineering plastics for machine materials or electronic parts. In molding a thermoplastic resin, in order to improve productivity, it has been proposed to blend, for the purpose of reducing melt viscosity, promoting crystallization and improving mold releasability, various resin modifiers, e.g., fatty acids such as stearic acid, metal salts of fatty acids, ester derivatives prepared from a fatty acid with a polyhydric alcohol such as pentaerythritol, polyethylene glycol or the like, aliphatic amides such as ethylenebisstearamide, etc. (Japanese Unexamined Patent Publications (Kokai) No. 44547/1985 and No. 250049/1991).
However, since heat-resistant thermoplastic resins generally have a high fusing temperature, said resin additives may thermally decompose or boil when melted, thereby tending to stain a mold or form void in the resin. For this reason, it has been desired to develop heat-resistant resin modifiers.
In view of the recent increasing need for plastic materials of high performance, polyarylene sulfide (PAS) excellent in heat resistance, mechanical characteristics and chemical resistance is attracting attention, and is now used for extending applications, for example, as automotive parts, parts for precision machines, electric and electronic parts, etc.
PAS is a crystalline engineering plastic but has low crystallization rate. Therefore, in order to obtain a resin of sufficient mechanical strength by injection molding, a high mold temperature of about 130.degree. C. and a prolonged cooling time were necessary. This defect posed a serious problem in extending the applications of PAS, and it is desired to mold PAS in a short time at a mold temperature of not higher than 100.degree. C. which is among the molding conditions for resin-molding apparatus commonly used.
To solve this problem, there have been proposed a method of increasing the mold releasability by adding a fatty acid ester (Japanese Unexamined Patent Publication No.154867/1992), an aromatic sulfonamide (Japanese Unexamined Patent Publication No.59279/1993) or the like, and a method of promoting the crystallization by adding a modified polyalkylene glycol (Japanese Unexamined Patent Publication No.250049/1991) or an organic phosphoric acid metal salt (Japanese Unexamined Patent Publication No.142854/1990) or the like.
However, because of insufficient heat resistance of the resulting resin compositions, these methods entail the problem of failing to achieve the contemplated results and the problem of exhibiting reduced mechanical strength and heat resistance even if the mold releasability or appearance of the molded products may be improved.
DISCLOSURE OF THE INVENTION
An object of the present invention is to provide a novel and useful thermoplastic resin composition containing a resin modifier which is excellent in heat resistance.
Another object of the invention is to provide a novel and useful method of molding a thermoplastic resin composition, which method is feasible even at a low temperature without deteriorating the inherent mechanical characteristics and heat resistance of the thermoplastic resin, particularly polyarylene sulfide.
The inventors of the present invention conducted extensive research to solve the foregoing problems, and found that an imide compound having a specific structure can function as a resin modifier having the desired performance since the imide compound per se has high heat resistance and reduces the melt viscosity of thermoplastic resins, increases the crystallizability of crystalline thermoplastic resins or enhances the mold releasability, etc. The present invention has been accomplished based on these novel findings.
The present inventors further found that when a thermoplastic resin composition, particularly a polyarylene sulfide resin composition, containing the above specific imide compound
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Fujitani Kango
Mizutani Toshihiro
Nakazawa Mikio
Morgan Kriellion S.
New Japan Chemical Co. Ltd.
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