Process for solder ball interconnecting a semiconductor device t

Details Process for solder ball interconnecting a semiconductor device t Process for solder ball interconnecting a semiconductor device t

1993-08-12

1996-04-02

Fourson, George

Fishing, trapping, and vermin destroying

437183, 22818022, H01L 21283, H01L 2158, H01L 2160

Patent

active

055040357

ABSTRACT:
A process of interconnecting a semiconductor device to a substrate wherein solder balls on the semiconductor device are fused with one side of an embedded noble metal foil within a through hole in an interposer structure. Solder balls on the substrate are fused with the metal foil within the structure window on the other side of the metal foil.

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