Film forming method wherein a partial pressure of a reaction byp

Coating processes – Coating by vapor – gas – or smoke – Mixture of vapors or gases utilized

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4272552, C23C 1652

Patent

active

055038751

ABSTRACT:
A film is formed on a substrate by supplying a plurality of processing gases into a processing container and forming the film on the substrate from the processing gases while exhausting a portion of the gases out of the processing container. Before a partial pressure of a byproduct in the processing container produced through chemical reaction of the processing gases reaches an equilibrium state, the partial pressure of the byproduct in the processing container is temporarily reduced by temporarily suppressing or stopping the supply of at least one of the processing gases into the processing container and exhausting gas from the processing container.

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Ohtsuka, N. et al. "A New GaAs on Si Structure Using ALAs Buffer Layers Grown by Atomic Layer Epitaxy"; Journal of Crystal Growth 99 (1990) Jan. Nos. 1/4 pp. 346-353.

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