Method of fabrication of endcap chip with conductive, monolithic

Details Method of fabrication of endcap chip with conductive, monolithic Method of fabrication of endcap chip with conductive, monolithic

1995-11-09

1996-11-05

Picardat, Kevin M.

Fishing, trapping, and vermin destroying

437208, 437211, 437214, 437217, 437220, 437226, H01L 2160

Patent

active

055717543

ABSTRACT:
An endcap chip is provided for a multichip stack comprising multiple integrated circuit chips laminated together. The endcap chip has a substrate with an upper surface and a edge surface, which extends in a plane orthogonal to the upper surface. At least one conductive, monolithic L-connect is disposed over the substrate such that a first leg extends at least partially over the upper surface of the substrate and a second leg extends at least partially over the edge surface of the substrate. When the endcap chip is located at the end of the multichip stack, the at least one conductive, monolithic L-connect electrically connects metal on an end face of the stack to metal on a side face of the stack. A fabrication process is set forth for producing the endcap chip with lithographically defined dimensions.

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