Method of packing filler into through-holes in a printed circuit

Details Method of packing filler into through-holes in a printed circuit Method of packing filler into through-holes in a printed circuit

1991-07-22

1993-12-07

Beck, Shrive

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

427 96, C23C 2600

Patent

active

052681947

ABSTRACT:
A method of packing filler into through-holes in a printed circuit board is disclosed. The method comprises steps of packing the filler through a mask into the through-holes and at the same time smoothing protrusions of the filler at the upper and lower openings of the through-holes by means of squeegees. In this method, the mask may be a silk screen provided with open-worked packing holes for packing the filler in the positions corresponding to those in which the through-holes of said printed circuit board are packed. In the above method, the filler may be packed by delivering pressurized filler from a packing nozzle, which comprises 1) a packing means connected both to a manipulation means for actuating a delivery valve for delivering the filler from said nozzle tip and to a supply means for supplying the filler and 2) a nozzle tip attached to the delivery end of said packing nozzle. In the above-described method, said filler may be a solvent-less filler.

REFERENCES:
patent: 4145691 (1992-09-01), Kawakami
patent: 4323593 (1982-04-01), Tsunashima
patent: 4324815 (1982-04-01), Mitani
patent: 4664945 (1987-05-01), Maeda
patent: 4938994 (1990-07-01), Choinski
patent: 5133120 (1992-07-01), Kawakami

Affiliated with

Also associated with

Rating

Method of packing filler into through-holes in a printed circuit does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of packing filler into through-holes in a printed circuit, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of packing filler into through-holes in a printed circuit will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2014497