Semiconductor component assembly

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

Patent

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Details

257713, 361715, H05K 720

Patent

active

061046159

ABSTRACT:
A VSMP semiconductor component is mounted by inserting an auxiliary element into a slot in a receptacle. The auxiliary element projects laterally from a narrow side of the semiconductor component and, as the auxiliary element is inserted into the slot, the semiconductor component is properly positioning on the printed circuit board.

REFERENCES:
patent: 4004195 (1977-01-01), Harayda
patent: 4157583 (1979-06-01), Busmajian
patent: 4867235 (1989-09-01), Grapes
patent: 5047837 (1991-09-01), Kitano
patent: 5671125 (1997-09-01), Russell
patent: 5877937 (1999-03-01), Shibata
patent: 5949650 (1999-09-01), Bulante

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