Thin-film forming method

Coating processes – Direct application of electrical – magnetic – wave – or... – Polymerization of coating utilizing direct application of...

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

427495, 427498, 427512, 427387, B05D 302, B05D 306

Patent

active

055715699

ABSTRACT:
A thin-film forming method comprising an uncured-layer forming step in which a mixed composition containing an organic polymerizing agent curable composition and a silicone polymerizing curable composition is prepared to form an uncured layer consisting of this mixed composition on a resin substrate; a solvent removing step in which the solvent in the uncured layer is removed; a first polymerization curing step in which the organic polymerizing curable composition in the uncured layer is polymerized; and a second polymerization curing step in which the silicone polymerizing curable composition in the uncured layer is polymerized. The thin-film forming method can comprise formation of the uncured layer on a resin substrate through the intermediation of a primer layer or formation of an uncured underlayer and uncured top layer followed by separate underlayer polymerization and top layer polymerization curing steps. The methods are applicable to the production of abrasion-resistant and water-repellent resin glass for automobiles.

REFERENCES:
patent: 3935346 (1976-01-01), Stengle et al.
patent: 4084021 (1978-04-01), Sandvig
patent: 4246298 (1981-01-01), Guarnery et al.
patent: 4758448 (1988-07-01), Sandvig et al.
Translation Of JP04-076059, Mar. 10, 1992.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Thin-film forming method does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Thin-film forming method, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Thin-film forming method will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2013435

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.