Fluorine-containing thermosetting resin

Details Fluorine-containing thermosetting resin Fluorine-containing thermosetting resin

1990-09-28

1992-03-24

Schofer, Joseph L.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Polymers from only ethylenic monomers or processes of...

526248, 526262, C08F12240

Patent

active

050989715

ABSTRACT:
A fluorine-containing thermosetting resin having a three-dimensional crosslinking structure is obtained by polymerizing a bismaleimide compound having the formula, ##STR1## wherein Rf is fluorine, CF.sub.3, C.sub.2 F.sub.5 or C.sub.3 F.sub.7. The resin is excellent in moldability, thermal resistance and electric properties, has a low dielectric constant, is hence suitable as a molding material and can be used for molding materials, wiring boards, layer insulation films of LSI, etc.

REFERENCES:
R. T. Morrison and R. N. Boyd, Organic Chemistry, 3rd Ed., Allyn and Bacon, Boston, 1973, pp. 358-365.

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